This report provides:
- An
overview of the global market for thermal interface materials, which have
experienced growing demand with the increased need for thermal management
technologies
- Analyses
of global market trends, with data from 2011 and 2012, and projections of
compound annual growth rates (CAGRs) through 2017
- Identification
of thermal interface materials (TIM) technologies and products with the
greatest commercial potential in the near to mid-term, and of companies that
are best positioned to meet this demand because of proprietary technologies,
strategic alliances, or other advantages
- Discussion
of TIM products, such as thermal greases, thermal compounds, thermal pads,
adhesive films and tapes, epoxies, and phase-change materials
- Applications
and end users
- Industry
structure and competition
- Patent
analysis
- Comprehensive
company profiles of developers and suppliers.
Introduction
Study Background
In recent
years, tremendous progress, both technologically and in terms of demand, has
been made in electronic devices and systems. The technological progress
has come on two main fronts: increased functionality on a single-device unit
and miniaturization of each unit. Both of these developments have
increased the need for thermal management technologies, including thermal
interface materials (TIM).
In the
thermal management of microelectronics, the interface material layer between a
chip and heat spreader presents the single largest barrier to heat flow in the
packaging of high-power dissipation devices. The selection of a suitable
material to fill the interface between a chip and a heat spreader is critical
to the performance and reliability of the semiconductor device. For this
reason, continuous effort has been made to develop new thermal interface
technologies.
BCC
Research has published a report on the market for all types of thermal
management technologies (SMC024G The Market for Thermal Management
Technologies, now in its seventh edition). BCC Research, however, believes that
the importance of TIM materials and the high rate of innovation merit more
detailed analysis in a report of their own.
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Study
Goals And Objectives
The goal of this report is to provide an up-to-date
analysis of recent developments and current trends in the global TIM materials
market. Specific objectives include:
- Identifying TIM technologies and products with the
greatest commercial potential in the near to mid-term (2010–2016).
- Analyzing the key drivers and constraints that
will shape the market for TIM technologies over the next five years.
- Estimating the current and future demand for TIM
technologies and products.
- Ascertaining which companies are best positioned
to meet this demand because of their proprietary technologies, strategic
alliances or other advantages.
Intended
Audience
This report is intended especially for suppliers of
TIM and others with a need to understand the status and dynamics of the market
for these products. The report is organized around specific technologies,
but it is largely nontechnical in nature and coverage, meaning it is concerned
less with theory and jargon than with identifying technologies that work,
projecting the amount of the latter the market is likely to purchase and
estimating the price that is likely to be paid.
As such, the report’s main audience is executive
management, business development, marketing departments and financial
analysts. It is not written specifically for scientists and
technologists, although its findings measure and analyze the market for their
work, including the availability of government and corporate research funding
for different technologies and applications.
Scope
And Format
The report addresses the global market for thermal
interface materials products during the period from 2011 through 2017,
including:
- Thermal greases.
- Thermal compounds.
- Thermal pads.
- Adhesive films and tapes.
- Epoxies.
- Phase-change materials.
- Metal-based TIM.
The report format includes these major elements:
- Executive summary.
- TIM overview.
- TIM technologies and products.
- Applications and end users.
- Developers and suppliers.
- Market estimates and projections.
- Industry structure and competition.
- Patent analysis.
The geographic scope for this report is the global
market.
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Information
Sources And Methodology
The findings and conclusions of this report are
based on information gathered using both primary and secondary research
methodologies from various sources. The primary sources of information
were Internet searches and industry association data, along with interviews
conducted with thermal interface material suppliers, custom engineering
companies and manufacturers of representative applications. Secondary
sources included industry journals and publications, product literature, white
papers and technical journals, and financial reports for industry suppliers.
The base year for analysis and projection is
2011. At the time this report was prepared (February 2013), 2012 data
were not yet available for all sectors. Therefore, with 2011 as a
baseline, market projections were developed for the period from 2012 to
2017. These projections are based on a combination of a consensus among
the primary contacts combined with BCC’s understanding of the key market
drivers and their impact from a historical and analytical perspective.
The analytical methodologies used to generate the market estimates are
described in detail in the market analysis.
