Combined flexible & printed
electronic applications could reach US$1B in 2020. Multiple applications are
driving growth!
Technical Challenges Are Close To
Being Overcome To Reach US $1B Market By 2020
Today
flexible & printed electronics create a lot of hope. And a supply chain is
being created to support an industrial infrastructure. In our report, we have
identified and tracked the five main functionalities of flexible & printed
electronics: displaying, sensing, lighting, energy generating and substrates.
The different degrees of freedom in flexibility that can be obtained can be
divided into:
- Conformable
substrate: the flexible substrate will be shaped in a definitive way after
processing
- “Bendable”
substrate: they can be rolled and bent many times (even if we consider it will
not be a key feature coming from customer needs)
- “Unused”
flexibility: in the end, the flexibility is not an added value to the customer
We believe
some applications will be more likely than other to be successful – for
example, bendable applications will undergo tough stress during use and
technological challenges will be hard to overcome. Our report shows the
distinction between the functions (displaying lighting, energy conversion,
sensing & substrates) and the seek flexibility “degree of freedom”. We do
not make the distinction in our report between organic and inorganic substrates
as semiconductors can also be used as flexible substrates.
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Key Features Of The Report
- Flexible
and printed electronics market forecast 2013 – 2020
- Application
roadmaps & timelines
- Detailed
manufacturing process flows
- Technical
challenges
- Analyzed
applications: displays, lighting, photovoltaics, sensing,substrates
- Polytronics
& smart systems
However,
we believe over the next several years, the number of applications using
printing processes for flexible electronics will grow.
We
estimate the printed & flexible electronics market will grow from ~ $176M
in 2013 to ~ $950M in 2020 with a 27% CAGR in market value. Printed OLED
displays for large size (TVs) are likely to become the largest market. For OLED
lighting, we believe it will grow but remain a niche market for automotive and/
or office lighting. For PV, the market demand by 2020 will remain very low
compared to the demand for rigid PV, largely below 1% of the global market
demand by 2020. Sensor, smart system & polytronic applications will include
sensors, touchless / touch screens, RFID applications.
A Wide, Exiciting Range Of New
Application
Printed
& flexible electronics is a new exiting technology with large potential
market expectations. Indeed, as semiconductors move to the very small with 22nm
critical dimension, printed electronics moves to the other end of the spectrum
with its own material, equipment, process challenges and supply chain. Printed
electronics will not kill semiconductor electronics as it will not be a
replacement for CMOS silicon. However, it will create new industry segments and
new classes of applications with unique features, benefits and costs that
cannot be addressed with conventional semiconductor electronics.
For
example, we believe printing technologies will also allow additional properties
such as flexibility. Originally, the general vision for printed electronics was
the possibility to print low cost electronic components on any substrate. It
was supposed to allow low cost, low efficiency, large volume electronics
manufacturing, and it was supposed to create a large multiplicity of
applications. Flexible electronics appeared quite soon after envisaging
printability. Such devices were supposed to allow new applications directly
linked to flexibility.
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Moreover,
the coming of polytronic technologies is a disruptive approach that could
change the way printed & flexible electronic devices will be manufactured.
It can be considered a new alternative to the “More Moore” approach where Si
ICs, thin films, micro batteries, displays etc … will be embedded in a flexible
substrate. The global interest in polytronics is born from the difficulties
faced by the flexible & printed electronics industry. It is an alternate
way to come to similar results while trying to avoid some of the main
challenges.
Manufacturing: Key Processing
Choices Are Still To Be Made
We have
identified strong technical challenges for the printed & fl exible
electronics industry to overcome if it is to be successful. Today it is still
more technopush rather than market-pull. Printed and fl exible electronics are
still looking for high throughput, high resolution deposition techniques in
order to become suitable for other markets than just a few niche highend
applications. For example, a big bottleneck is an efficient barrier technology.
Indeed, to be successful, the main technical challenge in the short term lies
in finding a good barrier technology: encapsulation materials are not so good
on flexible substrates. Solution printing process fl ow is composed of three
main steps: ink/coating creation, deposition and curing. I nk c hemistry i s a
pplication d ependent, and various precursors can be used for the same
application. The nature of the ink / coating will define what kind of process
can or cannot be used. For example, only inks containing very thin particles
can be used for inkjet printing (typically < 100nm particle for 1μm diameter
nozzles). In the same way, deposition methods induce specific requirements in
terms of viscosity. Deposition techniques vary, but most of them are not yet
adapted to large volume, low cost printed electronics. Thermal processing is
required in order to crystallize the ink. Curing temperature and time are
critical factors for printed electronics manufacturing as organic materials are
very sensitive to high temperatures.
Companies Cited In The Report
3M,
Add-Vision, AGC, AGFA, Air Products, Aixtron, Altadevices, Applied materials,
Arjowiggins, Arkema, Armor, Astron Flamm, Asys Solar, BASF, Beneq, Bosch,
Boschmann, Cabot, Cambrios, Canatu, Canon, Catrene, CEA LITEN, Central Standard
Timing, Ceradrop, Ceres, Chimet, CIT, CNM, Creative Materials, DEK, DisaSolar,
DNP, DOW, Dupont, Dupont Teijin, Dyesol, Dynamic Organic Light, Eight 19,
E-ink, Elecon, EMPA, EnFuCell, enthone, Epson, EVG, evonik, Flisom, Fraunhofer,
Fuji Film, G24i, GE, GEM,Global Solar, Global Solar Energy Deutschland GmbH
(GSED), Haiku Tech, HC Starck, Heliatek, HelioVolt, Heraeus, HMI, Honeywell,
IMEC, Inca Digital Printers, Infineon, Infinite Power solutions, Inkoa, InkTec,
ISET, ISORG, JRT, Konarka, Konica Minolta, Kovio, KUL, KWJ Engineering, LG, Liquavista,
LPKF, manroland, Markandy, MEMC, Merck, MiaSolé, Micro-tec, Mitsubishi
Chemical, Monocrystal, moserbaer, Nano ePrint, Nanoink, Nanomas, Nanosolar,
NextInput, Novacentrix, NTC, Ntera, Nuon Helianthos, Nuvosun, NVC, NXP,
Odersun, Optomec, Optony, Ormecon, Ormet, Osram, Panasonic, PEMCO, Pioneer,
PixDro, Philips, Plastic Logic, Plextronics, Polymer Vision, Prelonic
Technologies, Prime View International, Rena, Rolith, SAES, Sakurai, Samsung,
Schreiner, Showa Denko, Skiff, Solarion, Solaronix, Sony, SouthWest
Nanotechnologies, Sumitomo Chemical, Tianma, TNO, Toppan, TU Delft, Unidym,
UniSolar, Veeco, Verhaert, Vitex, Von Ardenne, Vorbeck Materials, VTT,
Wageningen University, Yotaphone
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